Harnessing the Materials Genome Conference

Public release date: 27-Jun-2012
[ | E-mail | Share ]

Contact: Kevin Korpics
kevin@engconfintl.org
Engineering Conferences International

An ECI Conference

US President Barack Obama introduced the Materials Genome Initiative (MGI) during his speech on June 24th 2011 at Carnegie-Mellon University when he announced the Advanced Manufacturing Partnership. The aim of MGI is "to discover, develop, manufacture, and deploy advanced materials at twice the speed than is possible today." The related document "Materials Genome Initiative for Global Competitiveness" released by the White House Office of Science and Technology Policy details the Materials Innovation Infrastructure (Figure 1) as consisting of computational tools, experimental tools and digital data. This conference will bring scientists and engineers together to discuss the state-of-the-art development on all three fronts of the Materials Innovation Infrastructure. The conference will be entirely focused on the technical side of these tools and their integration for accelerated materials design

Outline of the Conference Topics:

Computational methods for various materials properties
Multiscale modeling of microstructures and kinetic processes
New strategies to handle multi-scale and multi-temporal computations
Through process modeling
Multimodal characterization and digitization of microstructures
High-throughput measurement techniques for various materials properties
Combinatorial and experimental design approaches
Materials database structure and informatics tools
Industrial insertion and experiences
Confirmed Invited Speakers (April 27)

John Agren, Royal Institute of Technology (KTH), Sweden "Purpose-based modeling of microstructure evolution and kinetic processes"

John Allison, University of Michigan, USA
"Integrated Computational Materials Engineering - An essential ingredient of the Materials Genome Initiative"

Thomas Bligaard, Stanford University, USA
"Materials database structure and informatics tools"

David Cahill, University of Illinois - Urban-Champaign, USA
"High throughput mapping of the thermophysical properties of materials"

David Cebon and Michael Ashby, Cambridge University Engineering Department, UK
"Strategies for materials design"

Stefano Curtarolo, Duke University, USA
"Addressing the Materials Genome Initiative through the AFLOWLIB.ORG consortium: thermoelectric properties of sintered compounds with high-throughput ab initio calculations"

Dennis Dimiduk, Air Force Research Laboratory, USA
"Materials performance prediction for Integrated Computational Materials Engineering"

Ralf Drautz, Ruhr-Universitt Bochum, Germany
"Simplified models of the electronic structure for analyzing high-throughput data"

Giulia Galli, University of California - University of California Davis, USA
"Harvesting the energy from the sun: insights from atomistic and ab initio materials modeling"

Xin-Gao Gong, Fudan University, China
"Designing semiconductor PV materials by first principles method"

Somnath Ghosh, Johns Hopkins University, USA
"Modeling fatigue and failure in ductile materials"

Christopher Hutchinson, Monash University, Australia
"The use of diffusion couples in physical metallurgy: model calibration and mapping transitions in alloy behavior"

Karsten Wedel Jacobsen, TU Denmark
"Atomistic materials design using the computational materials repository"

Surya Kalidindi and T Fast, Drexel University, USA
"Leveraging data science to enable multiscale materials modeling and design"

Peter Lee, University of Manchester, UK
"Coupled microstructural-property models of structural materials validated via in situ synchrotron observations"

Zi-Kui Liu, Pennsylvania State University, USA
"MaterialsGenome: properties of individual phases from first-principles, statistic mechanics, and CALPHAD modeling"

Alfred Ludwig, Ruhr-Universitt Bochum, Germany
"Development of new materials using high-throughput thin film experimentation and up-scaling"

William Marsden, Granta Design, UK
"An information architecture for ICME"

Nicola Marzari, EPFL Lausanne, Switzerland
"Fast routes to screening electrical and thermal transport in novel materials"

Jrg Neugebauer, MPI Eisenforschung, Dsseldorf, Germany
"Materials design based on ab initio thermodynamics"

Toshio Ogata, NIMS, Japan
"New stage of MatNavi, materials database at NIMS"

Greg Olson, Northwestern University / QuesTek, USA
"From genome to flight"

Kristin Persson, Lawrence Berkeley National Lab, USA
"The Materials Project - a public Materials Design Platform"

Tresa Pollock, University of California - Santa Barbara, USA
"Integration of models and experiments: A case study for new Co-base single crystals"

Dierk Raabe, MPIE, Germany
"Rapid prototyping of structural bulk alloys"

John Rodgers, Innovative Materials Technologies, Gatineau, Canada
"Design of erosion resistant nanocoatings - from TRL 1 to TRL 6"

Gerhard Schneider and D. Goll, Hochschule Aalen, Germany
"High-throughput synthesis and analysis for searching new permanent magnet materials"

Ichiro Takeuchi, University of Maryland, USA
"Combinatorial discovery of novel multifunctional materials at structural phase boundaries through integrating combinatorial X-ray data with ICSD"

Michael Uchic, Air Force Research Laboratory, USA
"Modern methods to quantify microstructure and local mechanical properties in engineering alloys"

Yoshitaka Umeno, T. Tada, S. Hara, N. Shikazono,, University of Tokyo, Japan
"Multiscale modeling for material design of solid oxide fuel cell electrode"

Terrell Vanderah, NIST, USA
"NIST materials databases"

Yunzhi Wang, The Ohio State University, USA
"Better property modeling through microstructure and micromechanisms"

Jim Warren, NIST, USA
"The Materials Genome Initiative and a new paradigm for materials data"

Christopher Wolverton, Northwestern University, USA
"Materials for alternative energies: computational materials discovery and crystal structure prediction"

Rui Yang, Institute of Metal Research, China
"Computation-assisted design and development of a beta-titanium alloy for biomedical applications"

J.-C. Zhao, The Ohio State University, USA
"Materials property microscopy tools for the Materials Genome Initiative"

Alex Zunger, University of Colorado at Boulder, USA
"The inverse design problem: given a target property to find the material"

Conference Organization

Chairs
Prof. J.-C. Zhao (The Ohio State University, Department of Materials Science and Engineering)
Prof. Mark Asta (University of California, Berkeley, Department of Materials Science and Engineering)
Prof. Dr. Peter Gumbsch (Institutsleiter, Fraunhofer-Institut fuer Werkstoffmechanik IWM)
Prof. Boyun Huang (Central South University, China)

International Advisory Committee:

Prof. John Agren, KTH - Royal Institute of Technology, Sweden; Prof. John Allison, University of Michigan, USA; Prof. David Cahill, University of Illinois - Urban-Champaign, USA; Dr. David Cebon, Cambridge University Engineering Department, UK; Dr. Julie Christodoulou, Office of Naval Research, USA; Dr. Ram Darolia, GE Aviation (retired), USA; Dr. Dennis Dimiduk, Air Force Research Laboratory, USA; Dr. David Furrer, Pratt & Whitney, USA; Prof. K. Ishida, Tohoku University, Japan; Prof. C.T. Liu, City University of Hong Kong, China; Prof. Alfred Ludwig, Ruhr-Universitt Bochum, Germany; Prof. Jens K. Nrskov, Stanford University, USA; Prof. Greg Olson, Northwestern University, USA; Prof. Tresa Pollock, University of California - Santa Barbara, USA; Dr. John Rodgers, Innovative Materials Technologies, Gatineau, Canada; Prof. Ichiro Takeuchi, University of Maryland, USA; Prof. Ding-Sheng Wang, Institute of Physics, Chinese Academy of Sciences, China; Dr. Erich Wimmer, Materials Design, Inc., France; Prof. Jim Williams, The Ohio State University, USA .

###

Vail and the Vail Marriott Resort and Spa

Vail is a central access point for all kinds of on-mountain year round activities. Named after state highway engineer Charlie Vail who built the first highway through the area, the mountain wasn't "discovered" until the mid-1950s by 10th Mountain Division trooper Peter Seibert and local rancher Earl Eaton. When Seibert and Eaton hiked to the top of the mountain they looked out upon the vast open bowls and realized it was the perfect spot for ski slopes. In January 1962, their dream came alive and the U.S. Forest Service granted the final permit to Seibert and Eaton. Vail Mountain opened in December of the same year. Today Vail Mountain is North America's largest ski area, covering 5,289 acres with seven legendary bowls.

The locals split Vail into three neighborhoods: East Vail, Vail and West Vail. Within the "Vail" vicinity lie two villages. Coming into the valley on I-70 east, you'll drop into the gorgeous East Vail. East Vail is a residential neighborhood that shared one, quaint marketplace and is surrounded by the White River National Forest. The Forest provides an abundance of hiking trails in the summer and snowshoeing, cross-country skiing and ice climbing in the winter. East Vail is five miles from Vail's two villages with access to the gondola. Vail's free shuttle system runs through East Vail, a convenient service as curbside drop off plops you into Vail Village, the heart of all action. Also in East Vail is the popular Vail Racquet Club, which offers accommodations as well as an athletic facility including tennis and racquetball courts.

Only two miles from Vail Mountain is West Vail, which offers a variety of restaurants, retail shops, lodging and full-sized grocery markets - all with their own distinctive character. From sushi to Captain Crunch French toast to the best omelets in town, you can find it here. The free Town of Vail Shuttle service runs throughout the area. .

Marriott built its first resort in Colorado, the Vail Marriott Mountain Resort & Spa in 1971. Guestrooms offer unparalleled comfort with down pillows and custom duvets, an indoor pool, and outdoor heated pool, hot tub, fitness center and spa.

Engineering Conferences International (ECI) is a global engineering conferences program, originally established in 1962, that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines.

The format of the weeklong research conference provides morning and late afternoon or evening sessions in which major presentations are made. Available time is included during the afternoons for ad hoc meetings, informal discussions, and/or recreation. This format is designed to enhance rapport among participants and promote dialogue on the development of the meeting. We believe that the conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums.

All participants are expected both to attend the entire conference and to contribute actively to the discussions. The recording/photographing of lectures and presentations is forbidden. As ECI conferences take place in an informal atmosphere, casual clothing is the usual attire.

---

[ | E-mail | Share ]

?

AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert! system.

Public release date: 27-Jun-2012
[ | E-mail | Share ]

Contact: Kevin Korpics
kevin@engconfintl.org
Engineering Conferences International

An ECI Conference

US President Barack Obama introduced the Materials Genome Initiative (MGI) during his speech on June 24th 2011 at Carnegie-Mellon University when he announced the Advanced Manufacturing Partnership. The aim of MGI is "to discover, develop, manufacture, and deploy advanced materials at twice the speed than is possible today." The related document "Materials Genome Initiative for Global Competitiveness" released by the White House Office of Science and Technology Policy details the Materials Innovation Infrastructure (Figure 1) as consisting of computational tools, experimental tools and digital data. This conference will bring scientists and engineers together to discuss the state-of-the-art development on all three fronts of the Materials Innovation Infrastructure. The conference will be entirely focused on the technical side of these tools and their integration for accelerated materials design

Outline of the Conference Topics:

Computational methods for various materials properties
Multiscale modeling of microstructures and kinetic processes
New strategies to handle multi-scale and multi-temporal computations
Through process modeling
Multimodal characterization and digitization of microstructures
High-throughput measurement techniques for various materials properties
Combinatorial and experimental design approaches
Materials database structure and informatics tools
Industrial insertion and experiences
Confirmed Invited Speakers (April 27)

John Agren, Royal Institute of Technology (KTH), Sweden "Purpose-based modeling of microstructure evolution and kinetic processes"

John Allison, University of Michigan, USA
"Integrated Computational Materials Engineering - An essential ingredient of the Materials Genome Initiative"

Thomas Bligaard, Stanford University, USA
"Materials database structure and informatics tools"

David Cahill, University of Illinois - Urban-Champaign, USA
"High throughput mapping of the thermophysical properties of materials"

David Cebon and Michael Ashby, Cambridge University Engineering Department, UK
"Strategies for materials design"

Stefano Curtarolo, Duke University, USA
"Addressing the Materials Genome Initiative through the AFLOWLIB.ORG consortium: thermoelectric properties of sintered compounds with high-throughput ab initio calculations"

Dennis Dimiduk, Air Force Research Laboratory, USA
"Materials performance prediction for Integrated Computational Materials Engineering"

Ralf Drautz, Ruhr-Universitt Bochum, Germany
"Simplified models of the electronic structure for analyzing high-throughput data"

Giulia Galli, University of California - University of California Davis, USA
"Harvesting the energy from the sun: insights from atomistic and ab initio materials modeling"

Xin-Gao Gong, Fudan University, China
"Designing semiconductor PV materials by first principles method"

Somnath Ghosh, Johns Hopkins University, USA
"Modeling fatigue and failure in ductile materials"

Christopher Hutchinson, Monash University, Australia
"The use of diffusion couples in physical metallurgy: model calibration and mapping transitions in alloy behavior"

Karsten Wedel Jacobsen, TU Denmark
"Atomistic materials design using the computational materials repository"

Surya Kalidindi and T Fast, Drexel University, USA
"Leveraging data science to enable multiscale materials modeling and design"

Peter Lee, University of Manchester, UK
"Coupled microstructural-property models of structural materials validated via in situ synchrotron observations"

Zi-Kui Liu, Pennsylvania State University, USA
"MaterialsGenome: properties of individual phases from first-principles, statistic mechanics, and CALPHAD modeling"

Alfred Ludwig, Ruhr-Universitt Bochum, Germany
"Development of new materials using high-throughput thin film experimentation and up-scaling"

William Marsden, Granta Design, UK
"An information architecture for ICME"

Nicola Marzari, EPFL Lausanne, Switzerland
"Fast routes to screening electrical and thermal transport in novel materials"

Jrg Neugebauer, MPI Eisenforschung, Dsseldorf, Germany
"Materials design based on ab initio thermodynamics"

Toshio Ogata, NIMS, Japan
"New stage of MatNavi, materials database at NIMS"

Greg Olson, Northwestern University / QuesTek, USA
"From genome to flight"

Kristin Persson, Lawrence Berkeley National Lab, USA
"The Materials Project - a public Materials Design Platform"

Tresa Pollock, University of California - Santa Barbara, USA
"Integration of models and experiments: A case study for new Co-base single crystals"

Dierk Raabe, MPIE, Germany
"Rapid prototyping of structural bulk alloys"

John Rodgers, Innovative Materials Technologies, Gatineau, Canada
"Design of erosion resistant nanocoatings - from TRL 1 to TRL 6"

Gerhard Schneider and D. Goll, Hochschule Aalen, Germany
"High-throughput synthesis and analysis for searching new permanent magnet materials"

Ichiro Takeuchi, University of Maryland, USA
"Combinatorial discovery of novel multifunctional materials at structural phase boundaries through integrating combinatorial X-ray data with ICSD"

Michael Uchic, Air Force Research Laboratory, USA
"Modern methods to quantify microstructure and local mechanical properties in engineering alloys"

Yoshitaka Umeno, T. Tada, S. Hara, N. Shikazono,, University of Tokyo, Japan
"Multiscale modeling for material design of solid oxide fuel cell electrode"

Terrell Vanderah, NIST, USA
"NIST materials databases"

Yunzhi Wang, The Ohio State University, USA
"Better property modeling through microstructure and micromechanisms"

Jim Warren, NIST, USA
"The Materials Genome Initiative and a new paradigm for materials data"

Christopher Wolverton, Northwestern University, USA
"Materials for alternative energies: computational materials discovery and crystal structure prediction"

Rui Yang, Institute of Metal Research, China
"Computation-assisted design and development of a beta-titanium alloy for biomedical applications"

J.-C. Zhao, The Ohio State University, USA
"Materials property microscopy tools for the Materials Genome Initiative"

Alex Zunger, University of Colorado at Boulder, USA
"The inverse design problem: given a target property to find the material"

Conference Organization

Chairs
Prof. J.-C. Zhao (The Ohio State University, Department of Materials Science and Engineering)
Prof. Mark Asta (University of California, Berkeley, Department of Materials Science and Engineering)
Prof. Dr. Peter Gumbsch (Institutsleiter, Fraunhofer-Institut fuer Werkstoffmechanik IWM)
Prof. Boyun Huang (Central South University, China)

International Advisory Committee:

Prof. John Agren, KTH - Royal Institute of Technology, Sweden; Prof. John Allison, University of Michigan, USA; Prof. David Cahill, University of Illinois - Urban-Champaign, USA; Dr. David Cebon, Cambridge University Engineering Department, UK; Dr. Julie Christodoulou, Office of Naval Research, USA; Dr. Ram Darolia, GE Aviation (retired), USA; Dr. Dennis Dimiduk, Air Force Research Laboratory, USA; Dr. David Furrer, Pratt & Whitney, USA; Prof. K. Ishida, Tohoku University, Japan; Prof. C.T. Liu, City University of Hong Kong, China; Prof. Alfred Ludwig, Ruhr-Universitt Bochum, Germany; Prof. Jens K. Nrskov, Stanford University, USA; Prof. Greg Olson, Northwestern University, USA; Prof. Tresa Pollock, University of California - Santa Barbara, USA; Dr. John Rodgers, Innovative Materials Technologies, Gatineau, Canada; Prof. Ichiro Takeuchi, University of Maryland, USA; Prof. Ding-Sheng Wang, Institute of Physics, Chinese Academy of Sciences, China; Dr. Erich Wimmer, Materials Design, Inc., France; Prof. Jim Williams, The Ohio State University, USA .

###

Vail and the Vail Marriott Resort and Spa

Vail is a central access point for all kinds of on-mountain year round activities. Named after state highway engineer Charlie Vail who built the first highway through the area, the mountain wasn't "discovered" until the mid-1950s by 10th Mountain Division trooper Peter Seibert and local rancher Earl Eaton. When Seibert and Eaton hiked to the top of the mountain they looked out upon the vast open bowls and realized it was the perfect spot for ski slopes. In January 1962, their dream came alive and the U.S. Forest Service granted the final permit to Seibert and Eaton. Vail Mountain opened in December of the same year. Today Vail Mountain is North America's largest ski area, covering 5,289 acres with seven legendary bowls.

The locals split Vail into three neighborhoods: East Vail, Vail and West Vail. Within the "Vail" vicinity lie two villages. Coming into the valley on I-70 east, you'll drop into the gorgeous East Vail. East Vail is a residential neighborhood that shared one, quaint marketplace and is surrounded by the White River National Forest. The Forest provides an abundance of hiking trails in the summer and snowshoeing, cross-country skiing and ice climbing in the winter. East Vail is five miles from Vail's two villages with access to the gondola. Vail's free shuttle system runs through East Vail, a convenient service as curbside drop off plops you into Vail Village, the heart of all action. Also in East Vail is the popular Vail Racquet Club, which offers accommodations as well as an athletic facility including tennis and racquetball courts.

Only two miles from Vail Mountain is West Vail, which offers a variety of restaurants, retail shops, lodging and full-sized grocery markets - all with their own distinctive character. From sushi to Captain Crunch French toast to the best omelets in town, you can find it here. The free Town of Vail Shuttle service runs throughout the area. .

Marriott built its first resort in Colorado, the Vail Marriott Mountain Resort & Spa in 1971. Guestrooms offer unparalleled comfort with down pillows and custom duvets, an indoor pool, and outdoor heated pool, hot tub, fitness center and spa.

Engineering Conferences International (ECI) is a global engineering conferences program, originally established in 1962, that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines.

The format of the weeklong research conference provides morning and late afternoon or evening sessions in which major presentations are made. Available time is included during the afternoons for ad hoc meetings, informal discussions, and/or recreation. This format is designed to enhance rapport among participants and promote dialogue on the development of the meeting. We believe that the conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums.

All participants are expected both to attend the entire conference and to contribute actively to the discussions. The recording/photographing of lectures and presentations is forbidden. As ECI conferences take place in an informal atmosphere, casual clothing is the usual attire.

---

[ | E-mail | Share ]

?

AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert! system.

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